Data Integrity for On-Chip Interconnects - A Communication Theoretic Approach

di Singhal, Rohit
Stato: Nuovo
57,33 €
IVA inclusa - Spedizione GRATUITA
Singhal, Rohit Data Integrity for On-Chip Interconnects - A Communication Theoretic Approach
Singhal, Rohit - Data Integrity for On-Chip Interconnects - A Communication Theoretic Approach

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57,33 € IVA inclusa
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Consegna: tra venerdì 8 luglio 2022 e martedì 12 luglio 2022
Vendita & spedizione: Dodax

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57,34 € IVA inclusa
Stato: Nuovo
Spedizione gratuita
Consegna: tra venerdì 8 luglio 2022 e martedì 12 luglio 2022
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Descrizione

The desire for having a smaller-faster chip that does more than ever before, has led to shrinking feature size and growing integration density. This integration has left designers grappling with increasing concerns of signal-integrity (SI), timing- closure and power-consumption. Firstly, the shrinking feature size has resulted in greater delays. Further, the adjacent wires are now very close and cause Cross-talk to each other's signals. Traditional designs focus on protecting SI on long parallel wires. The SI designs accomodate the worst case delays of signals; while they aim to improve the worst-case delays at a circuit level using novel tricks, they are transparent to the actual data carried in the wires. Departing from this trend, this work aims to introduce an information theoretic approach to address data-integrity (DI). A novel approach for evaluating the data carrying capacity of long parallel wires is presented herein. This capacity is much greater than the data-rate achieved by SI designs. This work also proposes several practical designs with data-rate approaching this capacity.

Contributori

Scrittore:
Singhal, Rohit

Ulteriori informazioni

Biografia:
Dr. Singhal is a Senior Design Engineer, at Integrated Device Technology Inc. Dr. Choi and Dr. Mahapatra are both Associate Professors at Texas A&M University. This work resulted from Dr. Singhal's doctoral research performed under the guidance of Dr. Choi and Dr. Mahapatra at Texas A&M University.
Lingua:
Inglese
Numero di Pagine:
132
Tipo multimediale:
Copertina morbida
Editore:
VDM Verlag Dr. Müller

Dati Principali

Tipologia prodotto:
Brossura
Dimensioni del collo:
0.22 x 0.15 x 0.008 m; 0.245 kg
GTIN:
09783639203660
DUIN:
6VUK1OTVKFD
57,33 €
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